Qualcomm’s Snapdragon X2 Elite Extreme sets a new performance bar for Windows PCs
www.windowscentral.com
From single-core speed to AI acceleration, Qualcomm’s new flagship outpaces Apple, Intel, and AMD — without sacrificing all-day battery life.

…In Geekbench 6.5 single-core, the X2 Elite Extreme posts a score of 4,080, edging out Apple’s M4 (3,872) and leaving AMD’s Ryzen AI 9 HX 370 (2,881) and Intel’s Core Ultra 9 288V (2,919) far behind…

…The multi-core story is even more dramatic. With a Geekbench 6.5 multi-core score of 23,491, the X2 Elite Extreme nearly doubles the Intel Core Ultra 9 185H (11,386) and comfortably outpaces Apple’s M4 (15,146) and AMD’s Ryzen AI 9 370 (15,443)…

…This isn’t just a speed play — Qualcomm is betting that its ARM-based design can deliver desktop-class performance at mobile-class power draw, enabling thin, fanless designs or ultra-light laptops with battery life measured in days, not hours.

One of the more intriguing aspects of the Snapdragon X2 Elite Extreme is its memory‑in‑package design, a departure from the off‑package RAM used in other X2 Elite variants. Qualcomm is using a System‑in‑Package (SiP) approach here, integrating the RAM directly alongside the CPU, GPU, and NPU on the same substrate.

This proximity slashes latency and boosts bandwidth — up to 228 GB/s compared to 152 GB/s on the off‑package models — while also enabling a unified memory architecture similar in concept to Apple’s M‑series chips, where CPU and GPU share the same pool for faster, more efficient data access…

… the company notes the “first half” of 2026 for the new Snapdragon X2 Elite and Snapdragon X2 Elite Extreme…

  • Zak@lemmy.worldEnglish
    18·
    20 hours ago

    I imagine things would be much closer if they put a giant heatsink that Ryzen 370 they’re comparing and ran it at its 54W configurable TDP instead of the default 28W.